Checklist of Electrical Considerations


ItemConsideration from book "Computer Circuits Electrical Design" Status
12.3.1Chip Electrical Considerations
1Choice of Technology
1.1CMOS/BiCMOS/TTL/ECL
1.2Gate array (channeled or sea of gates)/standard cell/full customer/megacell/programmable logic device/chipsets
1.3Chip dc and ac specifications
1.4What SPICE models are provided by the vendor? What models need to be developed in-house?
1.5Is there easy migration from the present technology?
1.6Is the technology well supported by EDA?
1.7When is the chip available for engineering samples? full production?
1.8At production, what is the turnaround time from tape release to chip received?
2Physical
2.1What is the minimum transistor feature size (gate length for CMOS ASICs)?
2.2Size: basic cell, chip, wafer, contact via, interconnect width, and spacing
2.3Number of metal layers (signal, power, ground)
2.4What is the resistance and capacitance per unit length of metallization?
2.5What is the pad pitch?
3Performance Issue
3.1What is the basic gate delay (unloaded/lightly loaded/fully loaded)?
3.2Does the chip toggle at the frequency targeted?
3.3Does chip meet timing requirements on critical paths?
3.4What are latch setup and hold times?
3.5What is the mean time between failure due to metastability?
3.6What is the delay process variation?
4Functionality Issues
4.1Is the gate library complete?
4.2Does the usable gate count meet the integration requirement?
4.3Does the chip pin count meet the I/O requirement?
4.4Does the clock distribution scheme meet the skew control reuqirement?
4.5Are special drivers deeded (for example, differential driver, long-distance driver, pull-up driver, bidirectional driver, chip reentry driver)?
4.6Are special macros needed (for example, scan- or test-related macros, translation macros between two different technologies, ring oscillators)?
4.7Is embedded RAM required? What size and word organization?
4.8How many outputs can switch simultaneously?
4.9What is the α particle noise immunity?


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